I’m a digital IC design engineer with a strong focus on ASIC, CPU architecture, RTL, and SoC.
My experience spans RISC-V SoC tape-out on TSMC 65nm (Apple Inc. sponsored), a 3-way Out-of-Order (OoO) R10K processor, and RTL implementation of FIR filters and CNN accelerators. I’ve also worked on VLIW-based TPU design during my 2025 summer internship at Zhonghao Xinying Technology Co., Ltd. (Taize Semiconductor R&D Center), extending ISA and building vector/scalar functional units.
Let’s connect! 📧 yuan0minor3@gmail.com | yj2848@columbia.edu
M.S., Electrical Engineering, Expect Dec 2025
Columbia University
B.S., Electrical Engineering, May 2024
University of Minnesota, Twin Cities
B.S., Computer Engineering, May 2024
University of Minnesota, Twin Cities
B.A., Computer Science, May 2024
University of Minnesota, Twin Cities

This project taped out a 2 mm² 32-bit RISC-V processor SoC based on OpenHW Group’s CV32E40P RTL using TSMC 65nm technology, operating at 200 MHz with 2.177 mW total power. It Integrated SPI, UART, I2C, GPIO, AXI/AHB buses, clock generator, scan chain, and custom 2-port SRAMs.

An out-of-order, 32-bit processor based on a 3-way scaled R10K microarchitecture which supports the RV32IM ISA.

Designed and verified a 64-tap, 16-bit dual-clock FIR filter in Verilog RTL, achieving IEEE754 FP16 compliance, high energy efficiency (0.549 pJ/S), and 99.92% accuracy through synthesis, simulation, and back-annotation on IBM 130nm CMOS technology.

Architected and validated an 8-bit microprocessor in Cadence Virtuoso, achieving a compact 0.0149 mm² layout with DRC/LVS clean results and a critical path delay of 137 ps.
Summer Research & Senior Honors Project
Undergraduate Research Opportunities Program (UROP)
2023 Commencement Event: