Photo by Toa Heftiba on UnsplashYuan Jiang
Digital IC Engineer
I’m a digital IC design engineer with a strong focus on ASIC, CPU architecture, RTL, and SoC. My experience spans RISC-V SoC tape-out on TSMC 65nm (Apple Inc. sponsored), a 3-way Out-of-Order (OoO) R10K processor, and RTL implementation of FIR filters and CNN accelerators. I’ve also worked on VLIW-based TPU core design during my 2025 summer internship at Zhonghao Xinying Technology Co., Ltd. (Taize Semiconductor R&D Center), extending ISA and building vector/scalar functional units. Feel free to connect me! 📧 yuan0minor3@gmail.com | yj2848@columbia.edu .